{"code":200,"msg":"OK","obj":{"row":[{"id":17,"title":"2025第五届全球xEV驱动系统技术暨产业大会","path_banner":"http://img.ne-time.cn/f72519a7-296c-4f1b-9d79-9db7348eccfb.jpg?imageMogr2/quality/70/format/jpg","path_banner2":"http://img.ne-time.cn/dc80c5e2-11b1-463a-b8ce-cff42d84ca12.jpg?imageMogr2/quality/70/format/jpg","tag":"2","scale":"1500人+","detail":"电驱动系统作为核心 “心脏”，正经历着从技术突破到生态重构的深刻变革。随着全球 “双碳” 目标的持续推进，电动化、智能化、网联化浪潮交织，电驱技术的创新速度与产业协同深度，已成为决定新能源汽车竞争力的关键变量。","hightlight":null,"hightlight1":null,"hightlight2":null,"date_begin":1753977659000,"date_end":1754061067000,"address":"上海","description":"","company_json":null,"schedule_json":"{\"day\":\"Day0\",\"json\":[{\"k\":\"\",\"v\":\"下午
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电驱产业领袖峰会
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商用车电驱技术专场\"},{\"k\":\"话题方向:\",\"v\":\"1. 商用车电驱动关键技术与发展\"},{\"k\":\"\",\"v\":\"2. 商用车新拓扑纯电驱动总成构型技术\"},{\"k\":\"\",\"v\":\"3. 商用车电驱动总成零部件平台技术\"},{\"k\":\"\",\"v\":\"4. 商用车高效混合动力总成构型技术\"},{\"k\":\"\",\"v\":\"5. 基于新材料和新技术的新型机电耦合总成\"},{\"k\":\"\",\"v\":\"6. 新能源商用车驱动方案及电驱动桥的应用/多挡电驱传动方案及其关键技术\"},{\"k\":\"\",\"v\":\"7. 系统润滑与热管理\"},{\"k\":\"\",\"v\":\"8. 智能商用车测评技术研究与实践\"},{\"k\":\"\",\"v\":\"9. 功率半导体技术在新能源商用车上的应用\"},{\"k\":\"\",\"v\":\"10. 商用车市场发展及趋势\"}]}","schedule_json2":"{\"day\":\"Day2\",\"json\":[{\"k\":\"\",\"v\":\"会场一
电驱系统技术\"},{\"k\":\"专题1：混动系统\",\"v\":\"1. 新结构新构型机电耦合动力总成系统技术\"},{\"k\":\"\",\"v\":\"2. 新一代混动系统架构设计\"},{\"k\":\"\",\"v\":\"3. 新一代增程系统架构设计\"},{\"k\":\"\",\"v\":\"4. 混动DHT系统的集成化与小型化\"},{\"k\":\"\",\"v\":\"5. 混动系统的润和和热管理\"},{\"k\":\"专题2：集成化电驱系统\",\"v\":\"1. 高集成化电驱系统的开发与挑战\"},{\"k\":\"\",\"v\":\"2. 多合一电驱系统的EMC挑战和解决方案\"},{\"k\":\"\",\"v\":\"3. 新材料/新工艺/新拓扑电驱动系统技术\"},{\"k\":\"\",\"v\":\"4. 多合一电驱系统的NVH性能优化方案\"},{\"k\":\"\",\"v\":\"5. 多合一电驱动系统评价与标准体系/高密度电驱动总成效率提升与测评技术\"},{\"k\":\"\",\"v\":\"6. 多合一电驱动系统的维修与再制造/电驱动总成故障监测与寿命评估\"},{\"k\":\"专题3：分布式电驱与智能底盘的融合\",\"v\":\"1. 分布式驱动与智能底盘协同定义下一代新能源车操控范式\"},{\"k\":\"\",\"v\":\"2. 分布式驱动与智能底盘融合关键技术及发展趋势\"},{\"k\":\"\",\"v\":\"3. 分布式电驱动总成深度集成技术\"},{\"k\":\"\",\"v\":\"4. 分布式电驱总成域控融合控制平台/模块化底盘域控平台\"},{\"k\":\"\",\"v\":\"5. 分布式电驱与线控底盘与的信号融合与实时控制\"},{\"k\":\"\",\"v\":\"6. 如何通过域控制器实现电驱与底盘功能的算力共享\"},{\"k\":\"\",\"v\":\"7. 分布式驱动技术/角模块技术/轮毂/轮边电机技术突破\"},{\"k\":\"\",\"v\":\"8. AI算法与电驱动系统大数据平台融合技术\"},{\"k\":\"\",\"v\":\"9. 电驱系统与底盘协同设计的技术挑战\"},{\"k\":\"\",\"v\":\"10. 轻量化材料在电驱与底盘集成中的应用\"},{\"k\":\"\",\"v\":\"会场二
电机技术\"},{\"k\":\"专题1：定子精密智造与绝缘优化\",\"v\":\"1. 非晶定子铁芯高频损耗抑制策略\"},{\"k\":\"\",\"v\":\"2. 连续波绕工艺与设备兼容性改造\"},{\"k\":\"\",\"v\":\"3. 短PIN绕组激光焊接可靠性提升方案\"},{\"k\":\"\",\"v\":\"4. PEEK线材耐温等级与浸渍工艺协同性研究\"},{\"k\":\"专题2：转子创新设计与性能提升\",\"v\":\"1. 少稀土永磁材料磁性能优化路径（镝铁替代方案/晶界扩散技术）\"},{\"k\":\"\",\"v\":\"2. 碳纤维缠绕转子结构设计与疲劳寿命预测模型\"},{\"k\":\"\",\"v\":\"3. 30,000rpm+超高转速转子动力学仿真与台架验证方法论\"},{\"k\":\"\",\"v\":\"4. 注塑转子工艺对NVH特性的影响研究\"},{\"k\":\"专题3：新材料破界应用\",\"v\":\"1. 超导铜线低温系统集成方案与能效经济性分析\"},{\"k\":\"\",\"v\":\"2. 镁合金压铸壳体减重30%的振动抑制技术\"},{\"k\":\"\",\"v\":\"3. 发泡绝缘纸孔隙率对局部放电影响的量化研究\"},{\"k\":\"\",\"v\":\"4. 非晶带材在电机铁芯中的规模化应用\"},{\"k\":\"专题4：飞行汽车电机\",\"v\":\"1. 适用于飞行汽车驱动电机高功率密度设计\"},{\"k\":\"\",\"v\":\"2. 轻量化驱动电机与风动系统集成技术\"},{\"k\":\"\",\"v\":\"3. 飞行汽车动力系统安全性技术\"},{\"k\":\"\",\"v\":\"4. 飞行汽车动力系统噪声抑制技术\"},{\"k\":\"\",\"v\":\"会场三
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主持嘉宾:张舟云，上海电驱动股份有限公司副董事长\"},{\"k\":\"09:00-09:10\",\"v\":\"主持人开场\"},{\"k\":\"09:10-09:35\",\"v\":\"车规级SiC芯片封装、集成与测试技术\"},{\"k\":\"\",\"v\":\"刘朝辉，国家新能源汽车技术创新中心总师、先进电驱动业务单元负责人\"},{\"k\":\"09:35-10:00\",\"v\":\"新能源汽车驱动下的SiC模块发展应用\"},{\"k\":\"\",\"v\":\"顾天宏，芯动半导体产品市场总监\"},{\"k\":\"10:00-10:25\",\"v\":\"车规功率模块设计与应用\"},{\"k\":\"\",\"v\":\"朱晔博士，浙江晶能微电子有限公司副总裁\"},{\"k\":\"10:25-10:50\",\"v\":\"茶 歇 Tea Break\"},{\"k\":\"10:50-11:15\",\"v\":\"碳化硅功率模块技术发展前景及车载应用趋势\"},{\"k\":\"\",\"v\":\"孙炎权，基本半导体(无锡)有限公司副总经理\"},{\"k\":\"11:15-11:40\",\"v\":\"8英寸碳化硅单晶材料进展\"},{\"k\":\"\",\"v\":\"高玉强博士，湖南三安半导体有限责任公司总经理助理\"},{\"k\":\"11:40-12:05\",\"v\":\"智能化电机驱动系统健康管理技术进展\"},{\"k\":\"\",\"v\":\"范涛，中国科学院电工研究所研究员、国家重点研发计划项目负责人\"},{\"k\":\"12:05-13:30\",\"v\":\"午餐 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